PFAS free die attach for robust manufacturability of large body semiconductor packages

PurposeThe main purpose of this study is to explore the relationship between total quality management (TQM) practices and employees' propensity to remain within a large Malaysian semiconductor packaging organization. Despite extensive research on TQM practices, none examines this scope of investigative study. Therefore, the proposed model was developed with the intention of examining this relationship.Design/methodology/approachOriginal research using self‐completed questionnaires, distributed to all staff within this organization is thoroughly reported. The study sample consisted of 230 employees, resulting in a response rate of 76.6 percent. A questionnaire developed by Udo, Guimaraes and Igbaria was adapted for ascertaining the level of employees' propensity to remain. Data were analyzed by employing correlation and simple linear regression analysis.FindingsThe results revealed that customer focus, organizational trust, organizational communication, employee involvement and empowerment are positively associated with employees' propensity to remain. It is also found that where organizational trust was perceived as a dominant TQM practice; improvements in employees' propensity to remain levels were significant. Further, the result of the simple linear regression analysis supports the proposed model based on the empirically validated soft TQM instruments, which are reliable and valid.Originality/valueThe study contributes in advancing the TQM literature to a better understanding of the influence of TQM on the propensity to remain among employees within a major semiconductor sector.

Historically, for semiconductors subject to standard operating temperatures--which tend not to exceed 125°C--the Tg (glass transition temperatures) of the organic packaging materials protecting the chips is usually around 175°C. Given that, when it comes to electronics operating at high temperatures—typically an environment where the ambient temperature exceeds 200°C—the use of organic materials is generally prohibited due to rapid degradation. At those elevated temperatures, the packaging materials selected are generally composed of metals and ceramics but these materials come with their own shortfalls as well as higher material and manufacturing costs. Therefore, it would be desirable if there were ‘ruggedized’ versions of the organic compounds so commonly used in semiconductor packaging but available for more extreme temperatures, both to reduce cost and package footprint. Meanwhile, the demands from recent developments in high performance computing (HPC) and high-speed data networks means a greater need for increased power and thermal dissipation coupled with very large package body sizes to accommodate the high I/O count. The latest in server microprocessor (MPU) products can easily generate up to 300W during operation, and the heat generated must be quickly transported away from chip to prevent the threat of thermal shutdown. The thermal dissipation issue is controlled by the use of heat spreaders and heat sinks, both of which are intended to make contact with the back-side of a flipped MPU via a thermal interface material (TIM), as part of a large die, large body-size flip-chip ball grid array (FCBGA) package. The thermal interface materials discussed here are examples of organic engineered materials that are capable of withstanding higher operating temperatures than typically seen by semiconductors encased in organic-based packaging. This paper will look at the key material and mechanical attributes for a good thermal interface material, examines the pros-and-cons of various thermal interface material formulations, and discusses the factors for reliable thermal dissipation performance.

Taiwanese memory packaging and testing factories include Powertech, ChipMOS, ASE, SPIL, Walton and FATC. The global three first tier giants, Samsung Electronics, Hynix and Micron, have predicted that the DRAM market in 2014 will be more stable. With the three-giant monopolization taking shape, the strategic alliance and corresponding excess profits of back-end packaging factories are expected to be gradually improved. The computex new products covering semiconductors/components, green energy efficiency, Fujitsu wafer manufacturing, packaging and testing, and memories, etc. are going to take to the stage and Taiwanese IC design related firms are scrambling to grab any business opportunities. All of these will be sensationally showcased at the Taipei International Computer Show. 3D NAND will be the future trend and price competition will be the challenge of respective factories. SK Hynix and Samsung will race to launch green semiconductors, with which the information center trade will turn out to be the biggest customer. NAND Flash will march into the corporate storage market and the conventional storage trade will face a greater challenge. Fujitsu is optimistic about the demand for 4G transistors in 2014, in which the demand will be much stronger in the second half. Samsung and STMicroelectronics will expand its contract manufacturing of 28nm FD-Soi. SPIL, a packaging and testing factory, will devote its efforts to becoming the world 2nd largest packaging factory. As indicated by its president Lin Wen-Bo, as sustained by the popularity of smart phones, the demand for advanced semi-conductor packaging will continue to remain strong in 2014 which will lead to continuation of the profits. According to Korea, Times, the world number one technology giant Samsung has boasted its memory chip business, but the business has now been put to the tough test. For green energy efficiency and Taiwan's solar power integration, Morris Chang will be the key decision maker. Google will invest 600 million US dollars in the data center at Lenoir of North Carolina, and participate in foundry services. Apple's release of orders will offer more business opportunities, with which production of smart phones and components will expand.