Power-state-aware buffered tree construction

Multiple Dynamic Supply Voltage (MDSV) is a technique that focuses on reducing the dynamic power. This technique is an evolution of the Multiple Supply Voltage (MSV). MSV and MDSV introduce some difference on traditional physical synthesis due to the different voltage operations of each region in the design. To convert the voltage among regions supplied by different voltages, these techniques insert a Level Shifter (LS) circuit. As a penalty consequence, traditional LS circuits insert a delay and extra power consumption in the design. The dynamical behavior of MDSV designs has brought a new condition, where LS inserted in the circuit can be in an idle state temporally. This work presents a new architecture to reduce the power consumption and delay, bypassing the LS. The architecture explores an alternative path to current flow in the cases that LS is idle. With this new approach we reduce up to 15% of power consumption and up to 75% and 15% of delay.

Multiple supply voltages are commonly used in designs to enable better power performance through dedicated control of the supply voltage of the various functional units. In multiple supply voltage designs, circuits are partitioned into voltage islands that operate at their optimum supply voltages which necessitates the use of voltage level translators between them. This paper presents a high performance voltage level translator design aimed at minimizing insertion penalty by minimizing logic contention and thereby improving latency. In addition, the proposed voltage level translator design has an integrated logic multiplexer function built in through an enable signal. Simulation results of the proposed voltage level translator in comparison with the conventional voltage level translator shows upto 42% delay reduction, combined with a power benefit upto 15%, for supply voltage ranging from near-threshold to above-threshold levels.

Summary form only given. Power management techniques that leverage voltage as a handle are being extensively used in power sensitive designs. These techniques include power gating, power gating with retention, multiple supply voltages, dynamic voltage scaling, adaptive voltage scaling, multi-threshold CMOS, and active body bias. The use of the power management techniques also imply new challenges in validation and testing of designs as new power states are created. We look into verification issues along with the solutions to these issues using a verification strategy that involves power-aware simulation, rule-based structural checking, formal tools, and methodology recommendations. We detail our varied experiences with various design teams in addressing these low power verification issues for applications such as the wireless handset, low power microprocessors, and GPS.

Multiple supply voltages are often utilized to decrease power dissipation in high performance integrated circuits. On-chip power distribution grids with multiple supply voltages are discussed in this paper. A power distribution grid with multiple supply voltages and multiple grounds is presented. The proposed power delivery scheme reduces power supply voltage drops as compared to conventional power distribution systems with dual supplies and a single ground by 17% on average (20% maximum). For an example power grid with decoupling capacitors placed between the power supply and ground, the proposed grid with multiple supply and multiple ground exhibits, respectively, 13% and 18% average performance improvement. The proposed power distribution grid can be an alternative to a single supply voltage and single ground power distribution system.

Clock networks account for a significant fraction of the power dissipation of a chip and are critical to the performance. This paper presents theory and algorithms for building a low power clock tree. Two low power schemes are used: a reduced swing scheme and one using multiple supply voltages. We analyze the issue of tree construction and present conclusions relevant to various technology generations according to the National Technology Roadmap of Semiconductors (NTRS). Our experimental results show that the power could be saved an average of 45% for a 0.25 /spl mu/m technology using multiple supply voltages, and 31% using reduced swing buffers.

Multiple power supply voltages are often used in modern high-performance ICs, such as microprocessors, to decrease power consumption without affecting circuit speed. To maintain the impedance of a power distribution system below a specified level, multiple decoupling capacitors are placed at different levels of the power grid hierarchy. The system of decoupling capacitors used in power distribution systems with multiple power supplies is described in this paper. The noise at one power supply can propagate to the other power supply, causing power and signal integrity problems in the overall system. With the introduction of a second power supply, therefore, the interaction between the two power distribution networks should be considered. The dependence of the impedance and magnitude of the voltage transfer function on the parameters of the power distribution system is investigated. An antiresonance phenomenon is intuitively explained in this paper. It is shown that the magnitude of the voltage transfer function is strongly dependent on the parasitic inductance of the decoupling capacitors, decreasing with smaller inductance. Design techniques to cancel and shift antiresonant spikes out of range of the operating frequencies are presented. It is also shown that it is highly desirable to maintain the effective series inductance of the decoupling capacitors as low as possible to decrease the overshoots of the response of the dual-voltage power distribution system over a wide range of operating frequencies. A criterion for an overshoot-free voltage response is presented in this paper. It is noted that the frequency range of the overshoot-free voltage response can be traded off with the magnitude of the response.

The use of multiple supply voltages for energy and average power reduction is well researched and several works have appeared in the literature. However, in low power design using deep submicron and nanometer technology, the peak power, peak power differential, average power and total energy are equally critical design constraints. In this work, we propose datapath scheduling algorithms for simultaneous minimization of peak and average power while maintaining performance by use of dynamic frequency clocking and multiple supply voltages. The algorithms use integer linear programming based models. The dynamic frequency clocking methodology is more useful for data intensive signal processing applications. The effectiveness of our scheduling technique is measured by estimating the peak power consumption, the average power consumption and the power delay product of the datapath circuit. Furthermore, the proposed scheduling scheme is compared with combined multiple supply voltages and multicycling scheme. Experimental results show that combined multiple supply voltages (3.3V,2.4V) and dynamic frequency clocking scheme achieves significant reductions in peak power (72% on the average), average power (71% on the average) and power delay product (54% on the average).

We present an algorithm called MOVER (Multiple Operating Voltage Energy Reduction) to minimize datapath energy dissipation through use of multiple supply voltages. In a single voltage design, the critical path length, clock period, and number of control steps limit minimization of voltage and power. Multiple supply voltages permit localized voltage reductions to take up remaining schedule slack. MOVER initially finds one minimum voltage for an entire datapath. It then determines a second voltage for operations where there is still schedule slack. New voltages con be introduced and minimized until no schedule slack remains. MOVER was exercised for a variety of DSP datapath examples. Energy savings ranged from 0% to 50% when comparing dual to single voltage results. The benefit of going from two to three voltages never exceeded 15%. Power supply costs are not reflected in these savings, but a simple analysis shows that energy savings can be achieved even with relatively inefficient DC-DC converters. Datapath resource requirements were found to vary greatly with respect to number of supplies. Area penalties ranged from 0% to 170%. Implications of multiple voltage design for IC layout and power supply requirements are discussed.

In this paper, a tabu search-based behavior level synthesis scheme is proposed to minimize power consumption with resource operating at multiple voltages under the timing and the resource constraints. Unlike the conventional methods where only scheduling is considered, our synthesis scheme considers both scheduling and partitioning simultaneously to reduce power consumption due to the functional units as well as the interconnects among them. More importantly, our approach tends to efficiently address a few practical layout problems inherent to multiple voltage designs. In particular, we have configured our solutions as a three-tuple vector to account for both the timing and the partition. Cycling of the same solutions is prevented by applying a tabu list with an update mechanism enhanced with an aspiration function. In this way, the algorithm can search a large solution space with modest computation effort and fast convergence rate. Experiments with a number of DSP benchmarks show that the proposed algorithms achieve an average power reduction by 49.6%.

Clock networks account for a significant fraction of the power dissipation of a chip and are critical to performance. This paper presents theory and algorithms for building a low-power clock tree by distributing the clock signal at a lower voltage and translating it to a higher voltage at the utilization points. Two low-power schemes are used: reduced swing and multiple-supply voltages. We analyze the issue of tree construction and present conclusions relevant to various technology generations according to the NTRS. Our experimental results show that power savings of an average of 45% are possible for a 0.25 /spl mu/m technology using multiple supply voltages, and about 32% using a single external supply voltage.

Power dissipation is becoming the most challenging design constraint in nanometer technologies. Among various design implementation schemes, standard cell ASICs offer the best power efficiency for high-performance applications. The flexibility of ASICs allow for the use of multiple voltages and multiple thresholds to match the performance of critical regions to their timing constraints, and minimize the power everywhere else. We explore the trade-off between multiple supply voltages and multiple threshold voltages in the optimization of dynamic and static power. The use of multiple supply voltages presents some unique physical and electrical challenges. Level shifters need to be introduced between the various voltage regions. Several level shifter implementations will be shown. The physical layout needs to be designed to ensure the efficient delivery of the correct voltage to various voltage regions. More flexibility can be gained by using appropriate level shifters. We will discuss optimization techniques such as clock skew scheduling which can be effectively used to push performance in a power neutral way.

Recently, dynamic frequency scaling has been explored at the CPU and system levels for power optimization. Low-power datapath scheduling using multiple supply voltages has been well researched. In this work, we develop new datapath scheduling algorithms that use multiple supply voltages and dynamic frequency clocking in a coordinated manner in order to reduce the energy consumption of datapath circuits. In dynamic frequency clocking, the functional units can be operated at different frequencies depending on the computations occurring within the datapath during a given clock cycle. The strategy is to schedule high-energy units, such as multipliers at lower frequencies, so that they can be operated at lower voltages to reduce energy consumption and the low-energy units, such as adders at higher frequencies, to compensate for speed. The proposed time- and resource-constrained algorithms have been applied to various high-level synthesis benchmark circuits under different time and resource constraints. The experimental results show significant reduction in energy for both the algorithms.

Multiple supply voltage (MSV) is an effective scheme to achieve low power. Recent works in MSV are based on physical level and aim at reducing physical overheads, but all of them do not consider level converter, which is one of the most important issues in dual-vdd design. In this work, a logic and layout aware methodology and related algorithms combining voltage assignment and placement are proposed to minimize the number of level converters and to implement voltage islands with minimal physical overheads. Experimental results show that our approach uses much fewer level converters (reduced by 83.23% on average) and improves the power savings by 16% on average compared to the previous approach [1]. Furthermore, the methodology is able to produce feasible placement with a small impact to traditional placement goals.

As the device dimension is scaled down, interconnect RC delay becomes dominant performance limiter in high-performance VLSIs. Another issue in the submicron interconnects is a drastic increase of coupling capacitance due to the higher aspect ratio to reduce the interconnect resistance. The increase of the coupling capacitance degrades signal integrity, inducing noise problems and delay fluctuation problems. Buffer insertion (repeater insertion) is one of the most effective ways to decrease the interconnect delay. The original buffer insertion, however, cannot be applied to bi-directional buses because the buffer is uni-directional in nature. Some circuit configurations that can be applied to bi-directional buses have been proposed. These circuits turn out to be prone to malfunctions when there is a noise from adjacent lines in scaled down interconnect systems where capacitive coupling is large. A new buffer insertion scheme for bi-directional buses, namely the dual-rail bus (DRB) scheme, which does not have noise problems is proposed and measured in this paper. Another proposal is on a high-speed buffer insertion scheme for uni-directional buses by making use of staggered firing. The staggered firing bus (SFIB) is proposed and measured.

In the physical chip design under the ultra-deep submicron (UDSM) process, interconnect delay, internal resistance drop (IR drop), and signal integrity (SI) has become the key factors affecting timing convergence and design cycle. This paper introduces a reconfigurable array processor architecture chip to solve the above problems. It discusses the requirements of the chip, the logic synthesis, and the physical design under the SMIC 55nm process in detail. First, four different timing optimization methods are employed to optimize the critical path that affects the timing, thus accelerating the execution time of the subsequent placement and routing. Secondly, the edge placement method based on data flow is adopted to reduce the interconnect length and delay of interconnection. Finally, the power network synthesis, placement, clock tree synthesis, and routing are completed. The results demonstrate that the working frequency can reach 320MHz. Meanwhile, the resource consumption is 80506 logic gates, and the chip area is 12mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> .