Testing big chips becomes an internal affair

DFT (Design for Testability) is a methodology of testing for manufacturing defects in a chip. DFT consists of scan, ATPG (Automatic test pattern generation) methodologies and the BIST (Built in self-test) methods. This paper explores ATPG for pattern generation and LBIST (Logic built-in self-test) for testing. LBIST is explored and tested using pseudorandom test pattern generation. The fault list created for undetected faults are dumped into ATPG and fault specific test patterns are generated. These patterns detect the random pattern resistant faults (which are undetected by pseudorandom testing patterns). Further, a smart compression algorithm is defined to compress the pattern which can be stored inside the chip for LBIST testing, with no added memory overhead, and the minimum extra hardware (which only comprises of combinational logic). The proposed algorithm has been reviewed and analyzed and it has been found that the fault coverage achieved is 86.01%.

An automatic test pattern generation (ATPG) method is presented for a scan-based test architecture which minimizes ATE storage requirements and reduces the bandwidth between the automatic test equipment (ATE) and the chip under test. To generate tailored deterministic test patterns, a standard ATPG tool performing dynamic compaction and allowing constraints on circuit inputs is used. The combination of an appropriate test architecture and the tailored test patterns reduces the test data volume up to two orders of magnitude compared with standard compacted test sets.

The purpose of this paper is to present a conceptual approach and to make practical recommendations on how to improve the current Automatic Test Equipment (ATE) testing and maintenance capabilities by utilizing the existing cloud computing model to build a globally linked ATE maintenance system. The basic tenet of the ATE community is to support a multi-tiered maintenance concept which, in general, is a three tiered system that is composed of organizational maintenance (O-level), intermediate maintenance (I-level), and depot maintenance (D-level) organizations. The goal of the ATE is to (1) quickly and accurately detect and isolate each fault, (2) provide software tools for analyzing historical data, and (3) gather, manage, and distribute accurate and reliable maintenance information for the failed Unit Under Test (UUT). The ATE system should provide services that will (1) maintain a repository of information that will improve fault detection and isolation, allow for off-platform assessments, document failures, and help quantify corrective actions, (2) reduce false UUT pulls, and (3) reduce repair time by prompting repair procedures. Furthermore, the ATE system should provide additional services that will help optimize the time to diagnose problems by using collected failure information and by recommending entry points into the Test Program Set (TPS) software. It should also present information to the ATE maintainer to aid in informed repair decisions which could be in the form of pilot debrief results, platform Built In Test (BIT) results, O-level test outcomes and corrective actions, and maintenance and usage history of the platform and UUT. So, based on this definition of ATE maintenance the use of cloud computing can be used to provide services to improve the overall ATE testing throughput which will result in bottom line improvements to ATE life cycle costs. By using cloud computing, which is defined to be “a model for enabling ubiquitous, convenient, on-demand network access to a shared pool of configurable computing resources (e.g., networks, servers, storage, applications, and services) that can be rapidly provisioned and released with minimal management effort or service provider interaction”, users can develop cloud computing models that will provide access to application software and databases that can be used to build a globally linked ATE maintenance system. This paper will discuss the essential characteristics of the cloud computing models and define the various flavors of cloud offerings available to designers today. This paper will also analyze the cloud computing model to arrive at a conceptual approach that can be used to enhance the current ATE Testing and Maintenance capabilities. Practical recommendations will be discussed on how to transform the current ATE Testing and Maintenance capabilities into the specific cloud computing model offerings in order to help configure a globally linked ATE maintenance system.

For current VLSI designs, there are two kinds of well-accepted digital testing technologies. One is for embedded memories and the other is for the logic. For embedded memories, Built-In-Self-Test (BIST) is used. For the logic, the main solutions are based on scan DFT and automatic test pattern generation (ATPG). However, to reduce the need to use an external tester, and to ease test reuse at the system level, more designs are using BIST to test logic. In the future, with system on chip (SoC) requirements and deep Sub-Micron (DSM) technologies, we believe that BIST and scan-based ATPG will continue to be the main solutions to VLSI testing. However, to be successful, some improvements are needed. The author discusses future trends in three categories: test quality, test application cost and test development effort.

Scan testing is one of the Design for Testability (DFT) techniques that is widely being used to detect the emerging manufacturing defects in nanometer process technology. However, due to the advancement in System-on-Chip (SoC), over hundred million of logic gates have been implemented in a design resulting in high power dissipation and it has been revealed that power dissipation during scan testing could achieve three times higher than during normal operation due to the switching activity. Thus, the aim of this paper is to investigate the number of scan chains and Automatic Test Pattern Generation (ATPG) X-filling method in reducing the switching power and switching activity. In this work, 12 ISCAS89 benchmark circuits are used to run the scan test by using DFT Compiler and TetraMAX ATPG from Synopsys. Single scan chain up to 20 scan chains is implemented during scan chain insertion and 4 distinct ATPG X-filling methods—random filling, 0-filling, 1-filling and adjacent filling is applied. The switching power and switching activity for each iteration is evaluated to find the optimum number of scan chains and the best ATPG X-filling for each circuit. The simulation results show that out of 12 circuits, 5 of them exhibit preference towards single-digit number of scan chains to achieve optimal switching power performance and the decrement of switching power is ranged from 0.06% to 7.18% compared to single scan chain. Meanwhile, 7 out of 12 circuits gravitate towards 0-filling in reducing switching activity. The decrement of switching activity ranged from 4.23% to 60.63%.

Shrinking power budgets in low power system-on-chips (SoCs) have elevated test power consumption as a major consideration for chip design and test engineering teams. Many traditional automatic test pattern generation (ATPG) and design-for-test (DFT) techniques for test power reduction are either effective for circuits not using test data compression hardware or have implications on the physical design cycle. This paper describes a technique for reducing peak current during scan based testing that can work in the presence of compression, and impose no restrictions on physical design, e.g. related to chip clocking. We propose low-design effort modifications to the test compression logic (wrapper-like changes) that enable us to (a) bypass scan chains or groups of them and (b) shift in constant values into the bypassed flip-flops for lowering the instantaneous current drawn. The modifications are easily localized to a scan chain wrapper that can be used with any scan compression solution. An SoC using low-power scan chain wrappers provides sufficient configurability (scan chains bypassed or scan chains included) to explore different power reductions with test cost trade-offs. We describe a methodology that allows us to manage the inherent configurability available in our solution. For empirical validation, we have implemented low-power scan chain wrappers for a subset of scan chains in a recently taped-out 65nm low-power SoC. We present experimental data from ATPG and initial silicon power measurements for this chip to demonstrate the benefits and limitations of the proposal.

Digital circuit’s complexity and density are increasing while, at the same time, more quality and reliability are required. These trends, together with high test costs, make the validation of VLSI circuits more and more difficult. In this project we introduce the automatic test pattern generator with multiple single input change (SIC) vectors for post silicon validation schemes. Choosing a best device leads to challenges in various factors, In this paper performs a novel test pattern generator (TPG) for built-in self-test. Our method generates multiple single input change (MSIC) vectors in a pattern, i.e., each vector applied to a scan chain is an SIC vector. A reconfigurable Johnson counter and a scalable SIC counter are developed to generate a class of minimum transition sequences. The designed TPG is flexible to both the test-per-clock and the test-per-scan schemes.A theory is also developed to represent and analyze the sequences and to extract a class of MSIC sequences. Analysis results show that the produced MSIC sequences have the favorable features of uniform distribution and low input transition density. The performances of the designed TPGs and the circuits under test with 45 nm are evaluated. Simulation results with ISCAS benchmarks demonstrate that MSIC can save test power and impose no more than 7.5% overhead for a scan design. It also achieves the target fault coverage without increasing the test length.

Parallel computing is widely utilized to speed up automatic test pattern generation (ATPG); however, most of today's parallel ATPGs are non-deterministic, which often leads to non-reproducible test pattern sets. This paper presents a fault-parallel test pattern generator: CPP-ATPG; it generates the same test pattern set regardless of the thread count and timing. Besides, it exhibits good speedup scalability as the thread count increases. These are achieved by the circular pipeline processing (CPP) principle, which guides the proposed parallel ATPG to preserve the task processing orders that are necessary to ensure ATPG determinism but with low inter-thread synchronization overhead. Furthermore, a multi-round test generation and compaction strategy is proposed to avoid possible test pattern inflation. Experimental results show that CPP-ATPG exhibits close-to-linear speedup for at least up to 12 threads.

Conventional automatic test pattern generation (ATPG) algorithms fail when applied to asynchronous NULL convention logic (NCL) circuits due to the absence of a global clock and presence of more state-holding elements, leading to poor fault coverage. This paper presents a design-for-test (DFT) approach aimed at making asynchronous NCL designs testable using conventional ATPG programs. We propose an automatic DFT insertion flow (ADIF) methodology that performs scan and test point insertion on NCL designs to improve test coverage, using a custom ATPG library. Experimental results show significant increase in fault coverage for NCL cyclic and acyclic pipelined designs.

The role of built in test (BIT) in electronic systems has grown in prominence with the advances in system complexity and concern over maintenance lifecycle costs of large systems. In an environment where standards drive system designs (and provide an avenue for focused advancement in technology), standards for BIT are very much in an evolutionary state. The reasons for advancing the effectiveness of BIT include reduced support overhead, greater, confidence in operation, and increased system availability. The cost of supporting military electronic systems (avionics, communications, and weapons systems) has driven much of the development in BIT technology. But what about the systems that support these end items that contain test and measurement instrumentation - such as automatic test equipment (ATE), simulators and avionics development suites? There has also been a beneficial effect on the maintenance and availability of these systems due to the infusion of BIT into their component assemblies. But the effect has been much more sporadic and fragmented. This paper looks at the state of BIT in test and measurement instruments, explain its affect on system readiness, and present ideas on how to improve BIT technologies and standards. This will not provide definitive answers to BIT development questions, since the factors that affect it are specific to the instrument itself. The topics covered in this paper are: definitions of built-in test, instrument BIT history, importance of BIT fault coverage and isolation in support systems, overview of BIT development process issues that limit the effectiveness of BIT Standards related to instrument BIT, making BIT more effective in support system maintenance and availability and conclusions.

Boundary Scan is being added to the manufacturing test strategy. With no experience, where do you start? An organization venturing into this new territory must adopt changes in Test and Design processes to achieve a successful implementation as an enhancement to board test. Highlighting the benefits for the effort is key to getting buy-in from all groups involved from concept to product, especially the Design group. As experience is gained, less interaction between groups is required to implement Boundary Scan, but that relationship can never be severed without compromising the design or manufacturability. Addressing the issues of Design For Test (DFT) early in a product life-cycle will prevent costly oversights and mistakes. A methodical approach is necessary to design in Boundary Scan testability. Very complex designs can require significant design effort during schematic capture that hardware developers are not accustomed to providing. Often times, complex IC access points for developers share pins with the IEEE 1149.1 Test Access Port (TAP). Care must be taken to prevent a manufacturable Boundary Scan design from disabling a design debug port (and vice versa), requiring close coordination between Test and Development during this phase of the design. In addition, both groups must deal with the requirements for signal integrity so that test and programming time targets can be achieved. Solutions may include dedicated Boundary Scan components designed into the product and test fixture. Upon schematic completion, generation of test and programming vectors follows. (Vectors are the logic bits that are loaded into the Boundary Scan registers – taken from the term for a one-dimensional array.) The Automatic Test Pattern Generator (ATPG) tool must be capable of handling the specific requirements of your design such as programming of persistent memory and management of partitioning devices. Details of vector generation are beyond the scope of this discussion, however care and effort to ensure a match between the design netlist and physical manufacturing to achieve maximum test coverage may require changes to the development and production cycle of a new design and should be considered in scheduling resources. Bringing all of the prior efforts together to test a product doesn't complete the process. Deficient Boundary Scan implementations in ICs and oversights in the design can result in significant delays during the test of initial prototypes, delays that have never been experienced in a test cycle. These must be overcome through interaction with the part suppliers and the design group, and rectified to satisfy test coverage requirements. This method will be explained in generic terms to assist the reader in employing the technique in a product design with specific examples given from the implementation of boundary scan in a dense and complex Motorola Cellular Infrastructure board-set. The shift in test method for Motorola from bed-of-nails to Boundary Scan was intensified by the incorporation of a system-level 1149.1 architecture to re-use designed-in product features for postproduction testing.

The MPA and SSA development is approaching the production phase with an approximate volume of more than 200k ASICs, corresponding to 1200 wafers. The limited manufacturing yield requires testing strategies able to identify defective units and guarantee the correct functionality of the tracker modules. This contribution presents innovative methods to replace the currently used functional tests for the digital part of the ASICs, showing limited testing accuracy and long testing time. The proposed solution exploits the concept of structural test and new testing algorithms such as Automatic Test Pattern Generation (ATPG) for general digital logic and March for memory elements. Design for Testability (DFT) hardware is integrated on chip to test SRAM memories, peripheral logic and MPA pixel array, providing internal control and observation points for the implementation of the those algorithms. Particular attention is given to power increase, timing and placement impact as well as radiation tolerance of the introduced circuitry, which must be fully transparent during the normal operation of the chip. A faster and more accurate testing approach is presented, from design methodology to implementation choices and silicon results, for a reliable and cost effective testing procedure.

Null Convention Logic (NCL) is a robust asynchronous technique that poses new challenges to test and testability strategies due to the lack of a clock signal and the state-holding behavior of the NCL gates. The lack of deterministic timing in NCL complicates the management of test timing, and stuck-at faults on gate internal feedback (GIF) of the NCL gates exhibit a totally different effect compared to that of stuck-at faults on the gate inputs. Stuck-at faults on gate internal feedback of NCL gates do not always cause an incorrect output and therefore are considered hard-to-detect or undetectable by automatic test pattern generation (ATPG) algorithms. Such faults could leave the primary outputs of the circuit completely unaffected or sometimes they only affect the circuit by early detection of completeness. This work first proposes a clock-less self-timed ATPG, with no added design for test (DFT), that detects all of the faults on the gate inputs and a share of those on the GIF of gates. Then, this work investigates the effectiveness of <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">IDDQ</sub> (quiescent current) test for detecting stuck-at faults on GIF of NCL gates. Hspice is used for implementing static and semi-static transistor-level NCL gates in (45 nm, 1.1 V) technology, for which the supply current is measured and compared for fault-free and faulty circuits. The experimental results show that the faulty current is orders of magnitude higher than the fault-free leakage current. This considerable difference shows that I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DDQ</sub> testing might be an efficient and low-cost candidate for detecting stuck-at faults on GIF of NCL gates. The proposed I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DDQ</sub> test method along with the self-timed ATPG has resulted in average 98.16 and 98.04 percent fault coverage for static and semi-static implementations of several NCL circuits, respectively. To the extent of our knowledge, this is the first work that has addressed clockless, self-timed ATPG for NCL with no area overhead, and also the first work conducted on I <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DDQ</sub> test for NCL.

Design for Testability (DFT) provides for economic benefits and reduction in costs for design, manufacturing and support of electronic systems. The amalgamation of increased benefits and net reduced costs is value enjoyed throughout the life cycle of the system. While a number of formulas have been developed over the years to justify DFT, a unifying methodology is needed that can be used to calculate the overall economic value of DFT. The methodology we use in this paper relates known input benefit and cost parameters and map their dependencies to higher level DFT benefits and costs. This method demonstrates the numerous ways DFT can improve a system's life cycle value. It can also be used to justify the costs of DFT, such as added engineering labor, additional parts, higher cost boundary scan and built-in self test (BIST) parts. Moreover, they help convince financially focused management that DFT is a worthwhile investment even though the expenditures are in the early part of the life cycle and the return on that investment may be years later. Proponents of DFT need the methodology we present here to back up their assertions that DFT is profitable. Using dependencies lends itself to programming and calculations of DFT value can be readily performed by spreadsheet programs.

The development of new testing techniques to prolong the life of semiconductors is seen as an important issue in integrated circuit (IC) design as new fabricated devices in the manufacture of semiconductors keep increasing in complexity and performance. Any excessive power use demonstrated in the testing may lead to yield loss, failure due to IR drop, thermal reliability issues, and overdesign. This review gives an outset exploration of the field of power-aware Design-for-Testability (DfT) methods and practices that are used to reduce the power consumption of designs under test (both dynamic as well as static power) as the test coverage of the design remains high. Important areas are low-power scan architectures, power savings via shift, scan chain reordering, compressed test patterns and power-limited automatic test pattern generation (ATPG). Emerging developments that are also discussed by the paper include 3D IC-aware DfT, AI-based test generation, and security-integrated low-power testing. The discussed strategies are assessed by their contribution to green chip production, thermal control and cost-effectiveness in modern System-on-Chip (SoC) designs. Additionally, another challenging issue under critical review is the power-thermal correlation, the increasing volume of test data, and test access overheads. The research opportunities ahead incorporate the concept of machine learning, real-time monitoring of power, context-sensitive test scheduling so that scalable, secure, and energy-aware semiconductor testing systems can be supported.