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  • https://doi.org/10.1080/00207217.2012.713016Copy DOI Icon

Thermal-aware test scheduling using network-on-chip under multiple clock rates

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Abstract

The increasing trend in the number of cores on a single chip has led to scalability and bandwidth issues in bus-based communication. Network-on-chip (NoC) techniques have emerged as a solution that provides a much needed flexibility and scalability in the era of multi-cores. This article presents an optimal integer linear programming (ILP) formulation and a simulated annealing (SA) solution to thermal and power-aware test scheduling of cores in an NoC-based SoC using multiple clock rates. The methods have been implemented and results on various benchmarks are presented.

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