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  • https://doi.org/10.1109/esime.2010.5464531Copy DOI Icon

Vibration durability of Pb-free HVQFN assemblies

  • Apr 1, 2010
  • C Choi +5 more
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Abstract

In this paper, the vibration durability of SAC305 solder interconnects of Heat-sink Very-thin Quad Flat-pack No-leads (HVQFN) assemblies is investigated by accelerated stress testing and Physics-of-Failure (PoF) simulations, under various types of vibration excitation. In future work, these results will be used to develop PoF models for vibration fatigue durability of Pb-free SAC305 solder interconnects and to extract model constants from test data.

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