ASM Pacific Technology (China)

In this study, the fan-out chip-last panel-level packaging method in fabricating an ultralarge organic interposer of a hybrid substrate for heterogeneous integration is investigated. Emphasis is placed on the design, materials, process, fabrication, and simulation of thermomechanical reliability of a hybrid substrate ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$85\times80$ </tex-math></inline-formula> mm), which consists of an ultralarge organic interposer (four redistribution layers (RDLs) with the minimum metal linewidth ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$L$ </tex-math></inline-formula> ) and spacing ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$S$ </tex-math></inline-formula> ) = 2 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\mu \text{m}$ </tex-math></inline-formula> ), a 5-2-5 build-up package substrate, and Sn0.7Cu solder joints with underfill. Also, some recommendations will be provided.

This paper proposes a new multi-port flux-modulated permanent-magnet (FMPM) composite machine. The combination of the multi-port and flux-modulated configurations leads to the large torque capacity, high efficiency and fault-tolerant capability. Firstly, the composite flux modulation principle is specifically illustrated, as a general design principle of FMPM composite machines. Specific performance analysis is carried out to demonstrate the electromagnetic characteristics of the proposed machine, with auxiliary of the harmonic analysis. The composite flux modulation effect is proven for effective contribution to the higher torque density of the proposed FMPM machine. As a result, the proposed machine serves as a promising candidate in electric transportation applications.

The characteristics and quality of the bonding interface in hybrid bonding vary greatly depending on physical and chemical factors during the bonding process. Quantitative understanding and evaluation of the surface energy of the bond are essential to improve reliability. While destructive razor blade testing has been commonly used to quantify the surface energy and interface toughness in wafer-level bonding for years, there is currently no standard quantitative method for evaluating die-level direct bonding. In this study, the displacement control of single-beam cantilever (SBC) was specially developed as a new quantitative characterization method to evaluate the surface energy at the die level. For this characterization test, we first used a 10 × 10 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> die size with controlled bond surfaces, followed by a 6.3 × 10.3 mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> Cu hybrid bonding sample with an array of Cu bond pad size of 6 μm in diameter and 12 μm pitch. The pre-bonding process (wafer protection, dicing, cleaning, and surface activation), and die-level bonding methods were evaluated using this new characterization method. Process optimization resulted in die-level bonding consistency with surface energy higher than 2.0 J/m <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> , and voids-free bonding.

This paper introduces an original study of low-pass (LP) negative group delay (NGD) circuit.The family of the proposed passive network cross-topology was rarely investigated in the literature.It acts as a tri-port passive circuit presenting a cross-shaped topology.The present study of tri-port passive circuit is originally based on S-matrix modelling.The identification method of LP-NGD function type is established.The considered passive tri-port topology is innovatively constituted by a resistorless LC-passive network.Thanks to the impedance 3-D matrix modelling, the cross-circuit S-parameters are analytically expressed.Then, the NGD analysis at very low-frequencies is presented.The LP-NGD behavior existence condition of the cross-circuit in function of the L and C components is established.The relevance of the tri-port NGD circuit theory is verified by a proof-of-concept of resistorless cross-circuit.Analytical modelling, simulation, and experimentation confirmed the LP-NGD design feasibility with NGD value of about -2 ns and 6.67 MHz cut-off frequency.

This paper investigates on the theorization, design, fabrication and measurement of original phase shifter (PS) operating with two-step stair phase behavior. The innovative stair PS is designed with unfamiliar stop-band (SB) negative group delay (NGD) passive circuit. The elementary unfamiliar SB-NGD topology constituted by resistive, inductive, and capacitive lumped network is described. Acting as an RF and microwave circuit, the S-matrix model is expressed in function the RLC-network parameters. Thus, the canonical form of unfamiliar SB-NGD transfer function (TF) represented by the transmission coefficient is established. The unfamiliar SB-NGD circuit equations in terms of the NGD parameters are formulated. The established theory is validated comparing the calculated, simulated, and measured S-parameters and group delays (GDs). Results with a very good agreement showing unfamiliar SB-NGD behavior are observed around the central frequency 2.45 GHz and bandwidth of 100 MHz. An innovative application of unfamiliar SB-NGD function for the communication system front-end is developed. The developed application concept of unfamiliar SB-NGD circuit is illustrated by designing a microwave device operating as a PS presenting a two-step stair response completely original behavior. The basic theory, design and implementation of the two-step stair PS concept are introduced. To validate the two-step stair PS principle, a proof of concept (PoC) is designed based distributed element based inductive and capacitive microstrip elements. The simulated and measured results of the PS PoC are in good agreement. The experimental results confirm the feasibility of two-step stair PS with phase jumping from −70°±4° (from 2 GHz to 2.3 GHz) to −104°±2° (from 2.6 GHz to 3.0 GHz). The investigated unfamiliar SB-NGD function-based stair PS is promising for future development 5G and 6G communication system.

In order to fulfill a great demand of IoT and 5G technology, more and more Semiconductor Fabrication Equipment (SFE) have been manufactured. The fastest and most accurate machinery have been launched to the semiconductor industry. Without stringent and smart manufacturing consideration, it would lead the customers' safety risk. This review article introduces the newest European Union (EU) and United States (US) regulatory requirement and propose a detail compliant design rationale for SFE manufacturer. This article is a comprehensive tool for designer to understand the compliance design solution and implementation measures.