Wistron (Taiwan)

The rapid growth of cloud computing and big data has increased the need for reliable, scalable, and efficient storage solutions. Software-defined storage (SDS) systems, such as Ceph, have gained popularity because of their flexibility, scalability, and cost effectiveness compared to traditional storage architectures. This paper proposes a user-oriented architecture to optimize the storage efficiency of Ceph-based distributed storage systems by intelligently combining data compression and erasure coding techniques. The approach analyzes file types, system constraints, and user-defined priorities for cost, performance, and reliability. Based on this analysis, it dynamically selects appropriate compression and erasure coding policies to optimize storage efficiency and service quality. Experimental results on Ceph clusters demonstrate that the proposed methodology can significantly reduce storage space and achieve compression rates as high as 82.7% for certain file types while maintaining acceptable performance. The results confirm that adaptive integration of data compression and decoding in SDS environments can dramatically improve storage utilization and provide a flexible and reliable solution for modern data-intensive applications.

With the continuous advancements in semiconductor technology, the power consumption and heat flux density of chips have increased significantly, creating an ever-growing demand for more efficient thermal management solutions. The heat dissipation pathway of a chip begins at the chip itself (junction-to-case), then flows through the thermal interface material (TIM) to the thermal cooling solution, and is further dissipated into the surrounding environment or other devices. The TIM acts as a critical bridge between the chip and the thermal solution. If its performance is under expectation, even the most effective thermal solution will fail to achieve its maximum potential.

Intensive global research is focused on advanced conductive materials to meet the electrical requirements of the telecommunication and power industry. The primary aim is to enhance electrical conductivity, resulting of improved current-carrying capacity and reduced energy loss during transmission. Copper and its composites are vital for power transmission and telecommunications due to their electrical, thermal, and mechanical qualities. However, current methods have drawbacks, such as compromised conductivity with alloying. Graphene, an extraordinary carbon allotrope with exceptional properties and high conductivity, offers promising opportunities for the development of superior materials; such as graphene-incorporated copper (GrCu). The incorporation of graphene into copper wire holds significant potential for various industries, including electronics, energy transmission, and telecommunications, where high conductivity and reliability are paramount. This study investigates GrCu characteristics through mixing graphene and copper, vacuum melting, fine copper wire drawing, and GrCu coaxial cable manufacturing. Graphene infusion enhances conductivity and mechanical properties, altering microstructure and inducing twin boundaries in copper grains. Graphene's disruption during wire drawing triggers this effect, elevating wire conductivity to 103.5% by IACS. GrCu coaxial cable demonstrates performance coherence with HFSS simulation up to 6 GHz. Graphene's inclusion offers tailored material properties. Ongoing research promises further optimization and advancement of graphene-copper composites, paving the way for novel technological progress.

The demands for radio frequency (RF) of up-coming 5G electronic applications are gradually rising, arising recently from the need of smaller and thinner package in internet of things (IoT) and electronics devices. 3D system in package (3D SiP) including double side molding and antenna in package (AiP) could meet the above requirements. Dual side surface mounting technology (SMT) and double side molding are performed in this study to achieve miniaturization of 3D SiP module. A cost-effective and alternative molding process is completed by vacuum printing encapsulation systems (VPES) instead of common transfer molding. In this study, there are two kinds of double side molding structures, conformal and compartment molding, are employed with EMI shielding. Both molding architectures adopted conductive material as a dam to ensure electrical connectivity of side wall and sputtering metal layer to acquire EMI shielding effectiveness. To verify the reliability response of the molding structure, pre-conditioning is performed. A successful double side molding structure done by VPES with PCB warpage of 0.5 ~0.6 mm has been achieved in this work. Moreover, the dual side molding could reach the package requirements of 5G IoT module.

We employ a low-loss waveguide bend design having gradually-changed width and bending radius to realize a high-speed silicon micro-ring modulator (MRM) for o-band. The resultant silicon MRM enables a tuning efficiency of 35 pm/V, a quality factor of 5020, and an electro-optic bandwidth of 55 GHz.

Electronic communication devices used in many fields such as the internet, military, electronic industry, medical care, and electronic payment are growing rapidly. However, these demands lead to a new type ofpollution called noise or radio frequency interference (RFI) or electromagnetic interference (EMI), which may interfere with equipment performance and cause equipment shutdown. As a result, there is a great need for electromagnetic waves shielding and other components in the module would not be disturbed by outer electromagnetic waves. In this study, the influence factors of EMI shielding include forming process, coating thickness and material. Silver and copper are the metals adopted in EMI shielding due to their excellent properties of electrical conductivity and magnetic permeability. We focus on the effects of coating thickness and different processes including sputter, screen printing and spray. 2.4 GHz/5 GHz Wi-$\Gamma$i module is utilized for EMI shielding test. The results ofEMI block are measured by Keysight N9010B equipment to check electromagnetic waves shielding capability by dBm value at 4. 8GHz (2nd harmonic), 7.2 GHz (3rd harmonic) and 6.43 GHz (noise). Besides measurement by using functional products, radiation simulation is used to simulate antenna efficiency under designed coating thickness ofEMI shielding layer. The results of simulation and experiments show that coating thickness is the key factor to affect EMI shielding effectiveness. Moreover, processes of screen printing and spray are applicable and would be cost-effective alternates compared to sputtering.

A mm-Wave FMCW radar system with a low-complexity temporal convolutional network for non-contact exercise heart-rate monitoring is demonstrated. With around 10% of original parameters, we achieve 85% average accuracy on various types of exercise equipment.

Based on Volterra filtering, a novel pre-distortion method without significantly altering the transmitted spectra was proposed to eliminate nonlinear distortion in DML-based OFDM transmission. The scheme experimentally increased the capacity by >60% after 150-km transmission.