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  • https://doi.org/10.1109/isocc.2015.7401724Copy DOI Icon

Failure bitmap compression method for 3D-IC redundancy analysis

  • Nov 1, 2015
  • Keewon Cho +3 more
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Abstract

As the chance of memory faults has increased, many redundancy analysis (RA) techniques are widely used in order to gain a proper manufacturing yield. To find appropriate repair solutions, the external automatic test equipment (ATE) receives the faulty information and stores it into a 2-D failure bitmap. This paper presents a new failure bitmap compression method which utilizes modified run-length codes. The proposed idea can reduce hardware overhead of a failure bitmap while preserving all the faulty information that is needed to get optimal repair rate. Experimental results show that the proposed method can obtain more than 80% of reduction rate in the failure bitmap size.

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