重离子辐照带有ECC的65 nm SRAM器件“伪多位翻转”特性研究

Heavy ion-induced single event upsets (SEUs) of static random access memory (SRAM), integrated with three-dimensional integrated circuit technology, are evaluated using a Monte Carlo simulation method based on the Geant4 simulation toolkit. The SEU cross sections and multiple cell upset (MCU) susceptibility of 3D SRAM are explored using different types and energies of heavy ions. In the simulations, the sensitivities of different dies of 3D SRAM show noticeable discrepancies for low linear energy transfers (LETs). The average percentage of MCUs of 3D SRAM increases from 17.2 to 32.95%, followed by the energy of 209Bi decreasing from 71.77 to 38.28 MeV/u. For a specific LET, the percentage of MCUs presents a notable difference between the face-to-face and back-to-face structures. In the back-to-face structure, the percentage of MCUs increases with a deeper die, compared with the face-to-face structure. The simulation method and process are verified by comparing the SEU cross sections of planar SRAM with experimental data. The upset cross sections of the planar process and 3D integrated SRAM are analyzed. The results demonstrate that the 3D SRAM sensitivity is not greater than that of the planar SRAM. The 3D process technology has the potential to be applied to the aerospace and military fields.

Variability-aware 7T SRAM circuit with low leakage high data stability SLEEP mode

Advances in Very Deep Sub-Micron (VDSM) technology have made possible the integration of millions of transistors into a small area and consequently, has increased the circuit's density. The increase of Nano-Scale Static Random Access Memories (SRAMs) density has become an important concern for testing, since generated new types of defects that can occur during the manufacturing process. The rapidly increasing need to store more information results in the fact that the memory elements occupy great part of the System-on-Chip's (SoC) silicon area. In this context, the present paper describes and evaluates a technique based on On-Chip Current Sensors (OCCS) and Neighbourhood Comparison Logic (NCL) to detect resistive-open defects in SRAMs. Experimental results obtained throughout simulations demonstrate the technique's efficiency as well as its behaviour considering process variation. To conclude, an analysis of the overheads makes possible the comparison with today's standard techniques.

Multiple Cell Upsets (MCUs) induced by ionizing radiation in memories are becoming more likely to happen due to the continuous technology scaling down. Error Correction Codes (ECCs) are applied for recovering the stored information into its original state providing reliable computer systems. Several ECC are able to deal with MCUs, however, the higher the robustness of an ECC, more area, and energy is required for its implementation, becoming a problem if applied in application where resources are scarce. This article presents the implementation and evaluation of the Matrix Region Section Code (MRSC), a new algorithm for the detection and correction of multiple transient faults in volatile memories with low cost implementation. The experimental results measuring error coverage composed by detection and correction analysis, area, power and delay overheads have shown that MRSC is an excellent option to counteract with MCUs.

The significance of multiple cell upsets (MCUs) is revealed by sharing the soft-error test results in three major technologies, 90 nm, 65 nm, and 45 nm. The effectiveness of single-bit error correction (SEC) codes can be maximized in mitigating MCU errors when used together with the interleaving structure in memory designs. The model proposed in this paper provides failure probability to probabilistically demonstrate the benefits of various interleaving scheme selections for the memories with SEC. Grouped events such as MCU are taken into account in the proposed model by using the compound Poisson process. As a result of the proposed model, designers can perform predictive analysis of their design choices of interleaving schemes. The model successfully showed the difference in failure probability for different choices of interleaving schemes. The model behaved as the upper bound for failure probability when compared to the neutron test data with the 45-nm static-random-access memory (SRAM) design.

In this paper, single-event upset (SEU) is predicted using a combination of technology computer aided design (TCAD) and Geant4 Monte Carlo simulations. According to the layout topology of a 65 nm complementary metal-oxide-semiconductor (CMOS) static random access memory (SRAM) arrays, the sensitive volumes (SVs) of off and on-transistors were calibrated by TCAD using novel circuit schematics. The effects of on-transistor charge collection on SEU were studied, and a novel criterion for SEU occurrence is proposed. Heavy ion simulation results indicate that the probability of SEU recovery increased with increased ion energy and striking tilt. The simulated SEU cross section and multiple cell upsets (MCUs) percentage based on the proposed method are in agreement with the experimental data for 6 T SRAM cells, which were fabricated using 65 nm processing technology.

Today, the increasing need to store more and more information has resulted in the fact that Static Random Access Memories (SRAMs) occupy the greatest part of a System-on-Chip (SoC). Therefore, SRAM's robustness is considered crucial to guarantee the reliability of such SoCs over lifetime. In this context, one of the most important phenomena degrading nano-scale SRAMs reliability is related to Negative-Bias Temperature Instability (NBTI). This paper proposes a new approach based on an On-Chip Aging Sensor (OCAS) to detect SRAM aging during system lifetime. The sensor is able to detect any specific aging state of a cell in the SRAM array. The strategy is based on the connection of an OCAS per SRAM column, which periodically performs off-line testing by monitoring write operations into the SRAM cells to detect aging. The approach is application-transparent since it is does not change the SRAM contents after testing. To prevent OCAS from aging by one side and from dissipating static power by the other side, OCAS circuitry is powered-off during idle periods. SPICE simulations in a 65nm CMOS technology demonstrate the high sensor sensitivity to detect early aging states and so, guarantying high memory reliability. Furthermore, area overhead due to sensor insertion is almost negligible.

Multiple cell upsets (MCUs) become more and more problematic as the size of technology reaches or goes below 65 nm. The percentage of MCUs is reported significantly larger than that of single cell upsets (SCUs) in 20 nm technology. In SRAM and DRAM, MCUs are tackled by incorporating single-error correcting double-error detecting (SEC-DED) code and interleaved data columns. However, in content-addressable memory (CAM), column interleaving is not practically possible. A novel error correction code (ECC) scheme is proposed in this paper that will cater for ever-increasing MCUs. This work demonstrated that m parity bits are sufficient to cater for up to m-bit MCUs, with an understanding of the physical grouping of MCUs. The results showed that the proposed scheme requires 85% fewer parity bits compared to traditional Hamming distance based schemes.

To improve the reliability of static random access memory (SRAM), error-correcting codes (ECC) are typically used to protect SRAM in the cache. While improving the reliability, we also need additional circuits to support ECC, including encoding and decoding logic. In a high-speed circuit such as a CPU, the L1 cache maintains the same frequency as the CPU, and the decoding of the ECC codes in the cache consumes considerable combinational logic, resulting in limited frequency and performance. This study proposes a high-performance and flexible design scheme with ECC protection in the cache, in which the cache has two working modes: a high-performance mode and a high-reliability mode. The high-performance mode uses simple ECC codes, which can maintain high frequency with low access latency. The high-reliability mode uses more complex ECC codes, which improves the error correction capability and enhances the reliability of the SRAM. To meet the application requirements of different scenarios, the proposed scheme supports the software in switching between the above two modes by configuring the register, which improves the flexibility of the system. The results of synthesis show that the theoretical maximum frequency of proposed ECC design scheme increased from approximately 1.4 GHz in the conventional ECC design scheme to approximately 2.2 GHz. Some of the error correction capability of the high-performance mode is traded off against a 57% increase in frequency. In the high-reliability mode, the error correction capability of the SRAM is enhanced; however, the latency of accessing the cache increases by one cycle.

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A low power CMOS Static Random Access Memory (SRAM) based Field Programmable Gate Arrays (FPGA) architecture is being presented in this paper. The architecture presented here is based on CMOS logic and CMOS SRAMs that are used for on-chip dynamic reconfiguration. This architecture employs the fast and low-power SRAM blocks that are based on 10T SRAM cells. These blocks are employed in fast access of the configuration bits by using the shadow SRAM technique. The dynamic reconfiguration delay is being hidden behind the computation delay through the use of shadow SRAM cells. The combined effect of both the SRAM memory cells and the shadow SRAM scheme enables to support in reducing the delay and also to achieve reduced power consumption. Experimental results show reduced delay of about 8.035ns and power consumption of about 0.015W for the 10T SRAM memory cell with an overhead in area, relative to 4T and 6T SRAM cells. Also, the experimental results include the values of delay of about 8.979ns and power consumption of about 0.052W, achieved for the LB of FPGA architecture which employs CMOS SRAMs using the 10T SRAM memory cells in it.

Analytical reliability estimation of SRAM-based FPGA designs against single-bit and multiple-cell upsets

We present a comparative analysis of a fabricated 65nm CMOS static random access memory (SRAM) chip and commercial SRAM chips in terms of security vulnerability. The security vulnerability is defined as the leakage of information due to the data imprinting effect of the SRAM. There are three main features in this evaluation. First, a complete security vulnerability evaluation flow is proposed to stress the SRAM chips for accelerating the negative-biased temperature-instability (NBTI) degradation, i.e. data imprinting effect, and hence to reveal the stored data of image. Second, the evaluation quantifies the percentage of revealed data, i.e. leakage of information for the comparison of tested SRAMs. Third, the image is reconstructed from the revealed data to illustrate the security vulnerabilities of tested SRAMs. We perform the security vulnerability evaluation on the 65nm CMOS SRAM chip and 4 commercial SRAM chips, namely Alliance, Lyontek, Cypress and AMIC under stressing of high voltage and high temperature. From the experimental results, the stored data is significantly revealed in the deep-submicron (≤90nm) CMOS SRAM chips, i.e. fabricated 65nm CMOS (16.1%), Alliance (16.2%) and Lyontek (21%). After reconstructing the images, they can be identified in the 65nm CMOS, Alliance, Lyontek SRAMs, but remain as random states in the Cypress and AMIC SRAMs.

Soft errors have been a concern in memories for many years. In older technologies, soft errors typically affected a single memory cell but as technology scaled, Multiple Cell Upsets (MCUs) that affect a group of nearby cells have become more common. This trend is expected to continue making MCUs more frequent and also increasing the number of cells affected. To avoid data corruption in memories, Error Correction Codes (ECCs) are used. Single Error Correction (SEC) codes that can correct one bit error per word are effective only against single errors. To protect against MCUs, one option is to use more sophisticated error correction codes like for example, Orthogonal Latin Squares Codes (OLSC). In this paper, a modification of the OLSC decoding algorithm is proposed for codes that can correct two random errors. This modification has little impact on circuit complexity and enables triple adjacent error correction which is interesting when MCUs are present.

The continuous raise in the integration scale of CMOS technology has provoked an augment in the fault rate. Particularly, computer memory is affected by Single Cell Upsets (SCU) and Multiple Cell Upsets (MCU). A common method to tolerate errors in this element is the use of Error Correction Codes (ECC). The addition of an ECC introduces a series of overheads: silicon area, power consumption and delay overheads of encoding and decoding circuits, as well as several extra bits added to allow detecting and/or correcting errors. ECC can be designed with different parameters in mind: low redundancy, low delay, error coverage, etc. The idea of this paper is to study the effects produced when adding an ECC to a microprocessor with respect to overheads. Usually, ECC with different characteristics are continuously proposed. However, a great quantity of these proposals only present the ECC, not showing its behavior when using them in a microprocessor. In this work, we present the design of an ECC whose main characteristic is a low number of code bits (low redundancy). Then, we study the overhead this ECC introduces. Firstly, we show a study of silicon area, delay and power consumption of encoder and decoder circuits, and secondly, how the addition of this ECC affects to a RISC microprocessor.